Safe Switching
Full-Stack Embedded & IoT R&D
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Safe Switching electronic engineering and turnkey hardware prototyping laboratory
FULL-LIFECYCLE HARDWARE R&DIPC-A-610 CLASS 3

Turnkey Embedded R&D: Concept to Ready Hardware

High-density multi-layer PCB layout, deterministic FreeRTOS edge firmware, and cloud IoT telemetry consoles.

Request Technical Proposal
Up to 16 Layers• < 12µs ISR• 24h NDA
END-TO-END R&D PIPELINE

From Concept to Certified Hardware

01Phase 1 • Capture

Architecture & BOM

Microcontroller selection (ARM Cortex, RISC-V, ESP32), power budget calculation, and noise-isolated schematics.

Verified Milestone
02Phase 2 • Layout

Multi-Layer PCB

4 to 16-layer stackup design, 50Ω RF antenna trace tuning, differential impedance matching, and thermal copper planes.

Verified Milestone
03Phase 3 • Embedded

Firmware & Logic

Bare-metal C/C++, FreeRTOS deterministic multitasking, DMA audio streaming, and sub-15µA deep-sleep optimization.

Verified Milestone
04Phase 4 • Connected

Cloud & Mobile UIs

Bidirectional MQTT/WebSocket bridges, low-latency React web consoles, and native Flutter companion apps.

Verified Milestone
05Phase 5 • Production

DFM & Test Jigs

Bed-of-nails pogo-pin test fixtures, paste stencil masks, custom 3D enclosure CAD fitment, and automated factory flashing.

Verified Milestone
SPECIALIZED DISCIPLINES

Turnkey Engineering Disciplines

High-speed multi-layer custom PCB design layout by Safe Switching
IPC-A-610 Class 3
Turnkey layout in 5–10 business days

Custom PCB & Hardware Engineering

Multi-layer layout, schematic architecture, RF design, and Design for Manufacturing (DFM) verification.

Engineering Deliverables:
Controlled impedance modeling (Microstrip & Stripline with ±5% target)
High-speed differential pair routing (PCIe Gen 3/4, USB-C 3.2, MIPI CSI/DSI)
Blind, buried, and staggered laser microvias (HDI Type I, II, III)
Ansys SIwave / HFSS electromagnetic simulation for EMI/EMC compliance
Thermal relief arrays & copper-filled via-in-pad (IPC-4761 Type VII)
Altium 3654-16 LayersRF TunedDFM Pass
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Embedded firmware development and microcontroller programming
FreeRTOS / Bare-Metal
Sprint firmware milestone delivery in 2–4 weeks

Embedded Firmware & Edge Logic

Ultra-low power programming for STM32, ESP32, and Nordic chips with RTOS, Bare-Metal, and custom drivers.

Engineering Deliverables:
Low-level bare-metal peripheral drivers in modern C (C11/C17) and C++ (C++20)
Hard real-time deterministic task scheduling on FreeRTOS & Zephyr RTOS
Silicon architectures: ESP32-S3, STM32H7/G4, Nordic nRF52/nRF53, RP2350
Hardware-enforced secure bootloader, flash encryption, and mbedTLS crypto
A/B dual-bank failsafe Over-The-Air (OTA) firmware upgrade pipelines
FreeRTOSBare-Metal C/C++BLE 5.3OTA Updates
Request Feasibility
Custom IoT mobile application and telemetry web dashboard interface
mTLS / WebSockets
Complete telemetry infrastructure integration

Custom IoT Web & Mobile Applications

Telemetry web dashboards and native iOS/Android controller apps via BLE, Wi-Fi, MQTT, or AWS/Azure IoT.

Engineering Deliverables:
Cellular LTE-M / NB-IoT (Quectel BG95) & Wi-Fi 6 wireless telemetry
Ultra-low-power Bluetooth LE 5.3 direction finding & provisioning
Sub-100ms bidirectional voice/audio streaming protocols for edge clients
Serverless broker integration (AWS IoT Core, Azure IoT Hub, Custom MQTT)
Cross-platform Flutter / React companion apps for end-user management
React DashboardFlutter NativeWebSocketsAWS IoT Core
Request Feasibility
Functional turnkey IoT hardware device prototype and custom enclosure
Napkin to Mass SMT
Prototype batch in 7–14 business days

Turnkey Prototyping & Production Support

Proof-of-concept (PoC) to functional production hardware, custom 3D enclosures, and testing jigs.

Engineering Deliverables:
Precision 3D CAD mechanical enclosure modeling & CNC rapid milling
Design for Manufacturing (DFM) and Design for Assembly (DFA) audits
Automated SMT pick-and-place prototyping with paste stencil masks
Bed-of-nails custom automated functional test fixtures
FCC Part 15 and CE pre-compliance emissions and immunity testing
3D CAD / SLATest JigsBOM OptimizationPilot Runs
Request Feasibility
HARDWARE RIGOR

Hardware Capabilities Matrix

  • High-speed differential pairs (USB 3.x, MIPI, PCIe) with sub-0.05mm length matching.
  • Controlled impedance stackups (50Ω single-ended / 90–100Ω differential) modeled with polar Si8000.
  • RF tuning & antenna matching networks for 2.4 GHz, 868/915 MHz, and Sub-GHz LoRa transceivers.
  • Wide-bandgap GaN power stages, 5kV galvanic safety isolation, and precision battery management systems (BMS).
SOFTWARE RIGOR

Firmware & Cloud Telemetry Matrix

  • Deterministic interrupt service routines on FreeRTOS & Zephyr RTOS with zero heap fragmentation.
  • DMA circular double-buffering for sub-100ms bidirectional voice/audio edge-cloud streaming.
  • mTLS MQTT brokers, AWS IoT Core clusters, and offline SQLite buffering for zero telemetry loss.
  • Cross-platform Flutter companion mobile apps (iOS & Android) and real-time React web telemetry consoles.
24-Hour Engineering Feasibility Review

Ready to Prototype or Scale Your Hardware?

Submit your project parameters. Our senior hardware architects review your BOM, stackup viability, and firmware requirements under mutual NDA.

Request Hardware Proposal